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MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
3 Bit Registered Bus Transceiver
The MC10E/MC100E336 contains three bus transceivers with both transmit and receive registers. The bus outputs (BUS0-BUS2) are specified for driving a 25 bus; the receive outputs (Q0 - Q2) are specified for 50. The bus outputs feature a normal HIGH level (VOH) and a cutoff LOW level -- when LOW, the outputs go to -2.0V and the output emitter-follower is "off", presenting a high impedance to the bus. The bus outputs also feature edge slow-down capacitors.
MC10E336 MC100E336
3-BIT REGISTERED
* * * * * * * * *
25 Cutoff Bus Outputs BUS TRANSCEIVER 50 Receiver Outputs Transmit and Receive Registers 1500ps Max. Clock to Bus 1000ps Max. Clock to Q Bus Outputs Feature Internal Edge Slow-Down Capacitors Additional Package Ground Pins Extended 100E VEE Range of - 4.2V to - 5.46V 75k Input Pulldown Resistors The Transmit Enable pins (TEN) control whether current data is held in the transmit register, or new data is loaded from the A/B inputs. A LOW on both of the Bus Enable inputs (BUSEN), when clocked through the FN SUFFIX register, disables the bus outputs to -2.0V. PLASTIC PACKAGE CASE 776-02 The receiver section clocks bus data into the receive registers, after gating with the Receive Enable (RXEN) input. All registers are clocked by a positive transition of CLK1 or CLK2 (or both). Additional leadframe grounding is provided through the Ground pins (GND) which should be connected to 0V. The GND pins are not electrically connected to the chip. LOGIC DIAGRAM Pinout: 28-Lead PLCC (Top View)
TEN2 TEN1 25 BUSEN1 BUSEN2 RXEN VEE CLK1 CLK2 A0 26 27 28 1 2 3 4 5 B0 6 A1 7 B1 8 9 10 11 Q0 24 B2 23 A2 22 NC 21 VCCO 20 Q2 19 18 17 16 15 14 13 12 GND BUS2 VCC Q1 VCCO BUS1 GND A2 B2 TEN1 TEN2 RXEN BUSEN1 BUSEN2 CLK1 CLK2 DQ 0 1 DQ 0 A1 B1 1 DQ 25 CUTOFF D Q 50 A0 B0 0 1 DQ 25 CUTOFF D Q 50
BUS0 Q0
BUS1 Q1
25 CUTOFF D Q 50
BUS2 Q2
VCCO BUS0 GND
* All VCC and VCCO pins are tied together on the die.
12/93
(c) Motorola, Inc. 1996
2-1
REV 2
MC10E336 MC100E336
DC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = VCCO = GND)
0C Symbol VCUT IIH Characteristic Cut-off Output Voltage1 Input HIGH Current RXEN All Other Inputs Power Supply Current 10E 100E 125 125 min - 2.10 typ max - 2.03 225 150 150 150 125 125 min - 2.10 25C typ max - 2.03 225 150 150 150 125 144 min - 2.10 85C typ max - 2.03 225 150 mA 150 173 Unit V A Condition
IEE
1. Measured with VTT = - 2.10V
AC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = VCCO = GND)
0C Symbol tPLH tPHL ts Characteristic Propagation Delay to Output Clk to Q Clk to BUS Setup Time BUS, RXEN BUSEN A, B Data TEN Hold Time BUS, RXEN BUSEN A, B Data TEN Minimum Pulse Width Clk Rise/Fall Times 20 - 80% (Qn) 20 - 80% (BUSn Rise) 20 - 80% (BUSn Fall) min 500 825 150 100 300 450 450 500 350 200 400 300 500 300 450 800 500 700 1000 800 typ 700 1250 -150 - 200 - 50 150 150 200 50 -150 max 100 1800 min 500 825 150 100 300 450 450 500 350 200 400 300 500 300 450 800 500 700 1000 800 25C typ 700 1250 -150 - 200 - 50 150 150 200 50 -150 max 1000 1800 min 500 825 150 100 300 450 450 500 350 200 400 ps 300 500 300 450 800 500 700 1000 800 85C typ 700 1250 -150 - 200 - 50 150 ps 150 200 50 -150 ps max 1000 1800 ps Unit ps Condition
th
tPW tr tf
MOTOROLA
2-2
ECLinPS and ECLinPS Lite DL140 -- Rev 4
MC10E336 MC100E336
OUTLINE DIMENSIONS
FN SUFFIX PLASTIC PLCC PACKAGE CASE 776-02 ISSUE D
0.007 (0.180) U T L -M
M
B -NY BRK
M
S
N
S S
0.007 (0.180)
T L -M
N
S
D Z -L-M-
W
28 1
D X VIEW D-D G1 0.010 (0.250)
S
V
T L -M
S
N
S
A Z R
0.007 (0.180) 0.007 (0.180)
M
T L -M T L -M
S
N N
S
H
S
0.007 (0.180)
M
T L -M
S
N
S
M
S
C
E G G1 0.010 (0.250)
S
K1 0.004 (0.100) J -TSEATING PLANE
K F VIEW S 0.007 (0.180)
M
VIEW S T L -M
S
T L -M
S
N
S
N
S
NOTES: 1. DATUMS -L-, -M-, AND -N- DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIM G1, TRUE POSITION TO BE MEASURED AT DATUM -T-, SEATING PLANE. 3. DIM R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635).
DIM A B C E F G H J K R U V W X Y Z G1 K1
INCHES MIN MAX 0.485 0.495 0.485 0.495 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 -- 0.025 -- 0.450 0.456 0.450 0.456 0.042 0.048 0.042 0.048 0.042 0.056 -- 0.020 2 10 0.410 0.430 0.040 --
MILLIMETERS MIN MAX 12.32 12.57 12.32 12.57 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 -- 0.64 -- 11.43 11.58 11.43 11.58 1.07 1.21 1.07 1.21 1.07 1.42 -- 0.50 2 10 10.42 10.92 1.02 --
ECLinPS and ECLinPS Lite DL140 -- Rev 4
2-3
MOTOROLA
MC10E336 MC100E336
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JAPAN: Nippon Motorola Ltd.; Tatsumi-SPD-JLDC, 6F Seibu-Butsuryu-Center, 3-14-2 Tatsumi Koto-Ku, Tokyo 135, Japan. 03-81-3521-8315 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852-26629298
MOTOROLA 2-4
*MC10E336/D*
MC10E336/D ECLinPS and ECLinPS Lite DL140 -- Rev 4

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